Thermal Management Suite

Resistance Network → Junction Temperature

Series thermal path from ambient to junction. T_j = T_amb + Q·ΣR. Edit resistances; node temperatures update live.

Power Q (W)

T_ambient (°C)

T_j limit (°C) — for margin

Resistance (top→down)	R (K/W)

— junction temp

Three Modes of Heat Transfer

Conduction, convection, radiation for a given area & ΔT.

Area A (mm²)

ΔT (K)

k (W/m·K)

L (mm)

h (W/m²·K)

T_hot (°C)

T_cold (°C)

TIM & Thermal Via Array

R_TIM = BLT/(k·A)+R_c; via array R = R_single/N.

Interface material

BLT (µm)

k (W/m·K)

A (mm²)

Contact resist. R_c total (K/W)

Cu via array

Do (µm)

Di (µm)

L board (µm)

# vias N

Fin Performance

m=√(hP/kA_c), η=tanh(mL)/mL, Q=η·h·A_fin·ΔT.

h (W/m²·K)

k (W/m·K)

L (mm)

thick t (mm)

width w (mm)

ΔT base-to-air (K)

TEC / Peltier

Q_c=αIT_c−½I²R−KΔT, COP=Q_c/P.

α (V/K)

I (A)

R (Ω)

K (W/K)

T_cold (°C)

ΔT (K)

Forced-Air Cooling

ṁ = CFM·0.000472·ρ; ΔT = Q/(ṁ·c_p).

Airflow (CFM)

Heat load Q (W)

ρ_air (kg/m³)

c_p (J/kg·K)

Dimensionless Groups & Correlations

Re, Pr, Nu, Ra, Bi + Dittus-Boelter / flat-plate h.

V (m/s)

L char (mm)

ΔT (K)

ρ (kg/m³)

µ (Pa·s)

k_fluid (W/m·K)

c_p (J/kg·K)

k_solid (W/m·K)

Transient — Lumped Capacitance

τ = R_th·m·c_p; T(t) = T_∞ + (T₀−T_∞)·e^−t/τ. Valid when Bi < 0.1.

Mass m (g)

c_p (J/kg·K)

R_th (K/W)

T_final T_∞ (°C)

T_initial T₀ (°C)

Formula reference

Conduction Q=kAΔT/L, convection Q=hAΔT, radiation Q=εσA(T₁⁴−T₂⁴), linearized h_r=4εσT_m³.

R: cond L/kA, conv 1/hA; junction T_j=T_amb+Q·ΣR; TIM BLT/kA+R_c; via array R/N, A_via=(π/4)(D_o²−D_i²).

Fins m=√(hP/kA_c), η=tanh(mL)/mL. TEC Q_c=αIT_c−½I²R−KΔT, COP=Q_c/P. CFM→ṁ =CFM·0.000472·ρ.

Nu=hL/k, Re=ρVL/µ, Pr=µc_p/k, Ra=Gr·Pr, Bi=hL/k_s; Dittus-Boelter Nu=0.023Re^0.8Pr^n; transient τ=R·m·c_p.