TEC: cold-side heat Q_c=S·I·T_c−½I²R−K·ΔT; input power P=I²R+S·I·ΔT; COP=Q_c/P; hot-side reject Q_h=Q_c+P. Max-cooling current I_opt=S·T_c/R; ideal no-load ΔT_max=½·Z·T_c².
ZT: module Z=S²/(R·K), ZT=Z·T̄ (T̄ absolute). Material ZT=S²σT/κ; numerator S²σ is the power factor.
TEG: V_oc=S·ΔT; matched-load P_max=(S·ΔT)²/4R; efficiency η=(1−T_c/T_h)·(√(1+ZT)−1)/(√(1+ZT)+T_c/T_h).
Same TEC model as the Thermal Management Suite TEC card.